发明授权
- 专利标题: Stress memorization technique for strain coupling enhancement in bulk finFET device
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申请号: US15224128申请日: 2016-07-29
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公开(公告)号: US09660077B2公开(公告)日: 2017-05-23
- 发明人: Kangguo Cheng , Juntao Li , Chun-Chen Yeh
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 代理机构: Tutunjian & Bitetto, P.C.
- 代理商 Vazken Alexanian
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L29/66 ; H01L21/762 ; H01L21/265 ; H01L21/324 ; H01L29/10 ; H01L27/092
摘要:
A method for forming strained fins includes etching trenches in a bulk substrate to form fins, filling the trenches with a dielectric fill and recessing the dielectric fill into the trenches to form shallow trench isolation regions. The fins are etched above the shallow trench isolation regions to form a staircase fin structure with narrow top portions of the fins. Gate structures are formed over the top portions of the fins. Raised source ad drain regions are epitaxially grown on opposite sides of the gate structure. A pre-morphization implant is performed to generate defects in the substrate to couple strain into the top portions of the fins.
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