Invention Grant
- Patent Title: Electronic device and electronic device included in a cover
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Application No.: US14619564Application Date: 2015-02-11
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Publication No.: US09661771B2Publication Date: 2017-05-23
- Inventor: Seung Hyun Hwang , Hong Moon Chun , Soon Woong Yang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2014-0020463 20140221
- Main IPC: H04B1/38
- IPC: H04B1/38 ; H05K5/03 ; G06F1/16 ; H04M1/02 ; H04M1/04 ; H04M1/23 ; H04M1/18

Abstract:
An electronic device that can be attached to a cover and an electronic device attached to a cover are provided. The electronic device includes an electronic device body, a recess formed in an outer surface of the electronic device body, a movable member placed in the recess, an elastic member placed in the recess and supporting the movable member, and a retaining member placed in the recess and disposed around the movable member. The elastic member and the movable member are disposed to elastically bias the movable member from an inside of the recess to the outer surface of the electronic device body.
Public/Granted literature
- US20150245518A1 ELECTRONIC DEVICE AND ELECTRONIC DEVICE INCLUDED IN A COVER Public/Granted day:2015-08-27
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