Invention Grant
- Patent Title: Applying fluid to a substrate
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Application No.: US14327368Application Date: 2014-07-09
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Publication No.: US09662670B2Publication Date: 2017-05-30
- Inventor: Alex Veis , Alex Davidson
- Applicant: Hewlett-Packard Industrial Printing Ltd.
- Applicant Address: IL Netanya
- Assignee: Hewlett-Packard Industrial Printing LTD.
- Current Assignee: Hewlett-Packard Industrial Printing LTD.
- Current Assignee Address: IL Netanya
- Agency: HP Inc. Patent Department
- Priority: EP13177172 20130719
- Main IPC: B41J29/393
- IPC: B41J29/393 ; B41J29/38 ; B41J2/155 ; B41J11/00 ; B05B12/02 ; B05B7/00 ; B41J2/07 ; B41J2/21 ; B41J2/205 ; B41J2/515 ; B05B12/12 ; B05B3/00 ; B05B15/04 ; B05D1/02 ; B05D1/36 ; B05B12/04 ; B41J3/54
Abstract:
According to one example there is provided a system for applying fluid to a substrate using a first and second array of fluid applicators.
Public/Granted literature
- US20150024118A1 APPLYING FLUID TO A SUBSTRATE Public/Granted day:2015-01-22
Information query
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