Invention Grant
- Patent Title: Superposed structure 3D orthogonal through substrate inductor
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Application No.: US15046302Application Date: 2016-02-17
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Publication No.: US09666362B2Publication Date: 2017-05-30
- Inventor: David Francis Berdy , Chengjie Zuo , Daeik Daniel Kim , Changhan Hobie Yun , Mario Francisco Velez , Robert Paul Mikulka , Jonghae Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Alan Gordon; Kenneth Vu
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F41/04 ; H01F27/28 ; H01F27/29 ; H01F17/00 ; H01L49/02 ; H01L23/522
Abstract:
A three-dimensional (3D) orthogonal inductor pair is embedded in and supported by a substrate, and has a first inductor having a first coil that winds around a first winding axis and a second inductor having a second coil that winds around a second winding axis. The second winding axis is orthogonal to the first winding axis. The second winding axis intersects the first winding axis at an intersection point that is within the substrate.
Public/Granted literature
- US20160163450A1 SUPERPOSED STRUCTURE 3D ORTHOGONAL THROUGH SUBSTRATE INDUCTOR Public/Granted day:2016-06-09
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