Invention Grant
- Patent Title: Cable clamping system for strain relief and grounding
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Application No.: US14709049Application Date: 2015-05-11
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Publication No.: US09666978B2Publication Date: 2017-05-30
- Inventor: Juan Fernandez , Jeffrey Dujmovic , Brijeshkumar Meghpara , Eric Krieg
- Applicant: Rockwell Automation Technologies, Inc.
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Fay Sharpe LLP
- Main IPC: H01R13/58
- IPC: H01R13/58 ; H01R13/6592

Abstract:
An electronics module includes a cable clamp chassis projecting outward from a wall of the module. The cable clamp chassis includes first and second cable mounting locations adapted to receive respective first and second cables. The cable mounting locations each include an axially extending recess located adjacent a first reference plane. Each of the cable mounting locations includes an inner surface with an innermost point that lies tangent to a second reference plane that is parallel to and offset from the first reference plane such that the first and second cables are arranged in a zero stack configuration. A clamp is secured to the cable clamp chassis and adapted to secure the first and second associated cables in the first and second cable receiving locations.
Public/Granted literature
- US20160336683A1 CABLE CLAMPING SYSTEM FOR STRAIN RELIEF AND GROUNDING Public/Granted day:2016-11-17
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