Invention Grant
- Patent Title: Electric part soldered onto printed circuit board
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Application No.: US14484537Application Date: 2014-09-12
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Publication No.: US09668347B2Publication Date: 2017-05-30
- Inventor: Takayoshi Endo , Kenya Ando
- Applicant: DAI-ICHI SEIKO CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: DAI-ICHI SEIKO CO., LTD.
- Current Assignee: DAI-ICHI SEIKO CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2013-195877 20130920
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H01R12/70 ; H01R12/72 ; H01R43/02 ; H01R43/16 ; H01R4/02 ; H05K3/30

Abstract:
The electric part to be soldered to a metal pad mounted on a printed circuit board, includes a first surface facing the metal pad, a second surface extending from the first surface in a direction away from the metal pad, and a third surface outwardly extending from the second surface, the second surface and the third surface defining a space in which solder is stored.
Public/Granted literature
- US20150083478A1 ELECTRIC PART SOLDERED ONTO PRINTED CIRCUIT BOARD Public/Granted day:2015-03-26
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