发明授权
- 专利标题： Heat conductive adhesive film, method for manufacturing the same and OLED panel
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申请号： US14345815申请日： 2013-09-17
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公开(公告)号： US09669426B2公开(公告)日： 2017-06-06
- 发明人: Quanzhong Wang , Zhenhua Gu , Moyu Zhu
- 申请人： BOE HYUNDAI LCD INC. , BOE TECHNOLOGY GROUP CO., LTD.
- 申请人地址： CN Beijing CN Beijing
- 专利权人： BOE HYUNDAI LCD INC.,BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人： BOE HYUNDAI LCD INC.,BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址： CN Beijing CN Beijing
- 代理机构： Ladas & Parry LLP
- 优先权： CN201310177430 20130514
- 国际申请： PCT/CN2013/083598 WO 20130917
- 国际公布： WO2014/183361 WO 20141120
- 主分类号： H01L51/52
- IPC分类号： H01L51/52 ; H01L27/32 ; B05D3/04 ; B05D5/02 ; G09G3/3208 ; B05D1/26 ; B05D1/00 ; B05D5/10 ; B05D3/06 ; B05D1/02 ; C09J9/02
摘要：
A method for manufacturing a heat conductive adhesive film includes: forming a non-solid heat conductive adhesive layer with cured particles on a substrate; forming several bumps on the non-solid heat conductive adhesive layer while performing curing, so as to yield the heat conductive adhesive film with several bumps. A heat conductive adhesive film and an OLED panel are provided. Several bumps are formed on a flat surface of the heat conductive adhesive film, thus increasing the surface area of the heat conductive adhesive film such that heat from the heat generating unit can be duly discharged.
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