A method for manufacturing a heat conductive adhesive film includes: forming a non-solid heat conductive adhesive layer with cured particles on a substrate; forming several bumps on the non-solid heat conductive adhesive layer while performing curing, so as to yield the heat conductive adhesive film with several bumps. A heat conductive adhesive film and an OLED panel are provided. Several bumps are formed on a flat surface of the heat conductive adhesive film, thus increasing the surface area of the heat conductive adhesive film such that heat from the heat generating unit can be duly discharged.