- 专利标题: Process for production of sintered copper alloy sliding material and sintered copper alloy sliding material
-
申请号: US14168450申请日: 2014-01-30
-
公开(公告)号: US09669461B2公开(公告)日: 2017-06-06
- 发明人: Hitoshi Wada , Takashi Tomikawa , Daisuke Yoshitome , Hiromi Yokota
- 申请人: TAIHO KOGYO CO., LTD.
- 申请人地址: JP Toyota-shi
- 专利权人: TAIHO KOGYO CO., LTD.
- 当前专利权人: TAIHO KOGYO CO., LTD.
- 当前专利权人地址: JP Toyota-shi
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: JP2008-012403 20080123
- 主分类号: C22C9/02
- IPC分类号: C22C9/02 ; B22F3/10 ; B22F1/00 ; C22C1/04 ; C22C9/00
摘要:
Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
公开/授权文献
信息查询