Invention Grant
- Patent Title: Housing arrangement, method of producing a housing and method of producing an electronic assembly
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Application No.: US14424539Application Date: 2013-08-28
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Publication No.: US09673136B2Publication Date: 2017-06-06
- Inventor: Tobias Gebuhr , Thomas Schwarz
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102012215285 20120829
- International Application: PCT/EP2013/067777 WO 20130828
- International Announcement: WO2014/033152 WO 20140306
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/495 ; H01L33/48 ; H01L21/48 ; H01L23/31 ; H01L25/075
Abstract:
A housing arrangement includes a plurality of interconnected housings for electronic components, each housing including a leadframe section of a leadframe, wherein the leadframe section is formed from an electrically conductive material and has a receiving region that receives the electronic component and/or a contact region that contacts the electronic component, a molding material into which the leadframe section is embedded and which has at least one receiving opening in which the receiving region and/or the contact region are exposed, and at least one stress reduction opening formed in the molding material and free of the receiving region and/or the contact region, wherein the housings connect to one another via the leadframe and the molding material, the stress reduction openings are formed at transitions from in each case one of the housings to another of the housings.
Public/Granted literature
- US20150228562A1 HOUSING ARRANGEMENT, METHOD OF PRODUCING A HOUSING AND METHOD OF PRODUCING AN ELECTRONIC ASSEMBLY Public/Granted day:2015-08-13
Information query
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