Invention Grant
- Patent Title: Batch process for connecting chips to a carrier
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Application No.: US14451868Application Date: 2014-08-05
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Publication No.: US09673170B2Publication Date: 2017-06-06
- Inventor: Rupert Fischer , Peter Strobel , Joachim Mahler , Konrad Roesl , Alexander Heinrich
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L23/00 ; H01L25/00 ; H01L25/065 ; H01L25/18 ; H01L21/683 ; H01L23/495 ; H01L23/29 ; H01L23/31

Abstract:
Methods for connecting chips to a chip carrier are disclosed. In some embodiments the method for connecting a plurality of chips to a chip carrier includes placing first chips on a transfer carrier, placing second chips on the transfer carrier, placing the transfer carrier with the first and second chips on the chip carrier and forming connections between the first chips and the chip carrier and the second chips and the chip carrier.
Public/Granted literature
- US20160043054A1 Batch Process for Connecting Chips to a Carrier Public/Granted day:2016-02-11
Information query
IPC分类: