Invention Grant
- Patent Title: Interconnect and end plate design for fuel cell stack
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Application No.: US14072375Application Date: 2013-11-05
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Publication No.: US09673457B2Publication Date: 2017-06-06
- Inventor: Vijay Srivatsan , Michael Groesch , Daniel Darga , Matthias Gottmann , Ram Ramanan , Paturi Balaji Narasimha Prasad , Ramesha Guntanur , Ananda Sundararajan , Sachin Parhar
- Applicant: Bloom Energy Corporation
- Applicant Address: US CA Sunnyvale
- Assignee: BLOOM ENERGY CORPORATION
- Current Assignee: BLOOM ENERGY CORPORATION
- Current Assignee Address: US CA Sunnyvale
- Agency: The Marbury Law Group PLLC
- Main IPC: H01M8/0247
- IPC: H01M8/0247 ; H01M8/0276 ; H01M8/0228 ; H01M8/0258 ; H01M8/124

Abstract:
Various embodiments include interconnects and/or end plates having features for reducing stress in a fuel cell stack. In embodiments, an interconnect/end plate may have a window seal area that is recessed relative to the flow field to indirectly reduce stress induced by an interface seal. Other features may include a thicker protective coating and/or larger uncoated area of an end plate, providing a recessed portion on an end plate for an interface seal, and/or recessing the fuel hole region of an interconnect relative to the flow field to reduce stress on the fuel cell. Further embodiments include providing intermittent seal support to minimize asymmetric seal loading and/or a non-circular seal configuration to reduce stress around the fuel hole of a fuel cell.
Public/Granted literature
- US20140127602A1 INTERCONNECT AND END PLATE DESIGN FOR FUEL CELL STACK Public/Granted day:2014-05-08
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