- 专利标题： Electronic device and semiconductor package with thermally conductive via
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申请号： US14826207申请日： 2015-08-14
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公开(公告)号： US09674940B2公开(公告)日： 2017-06-06
- 发明人: Eung-chang Lee , Seok-jae Han
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- 代理机构： Muir Patent Law, PLLC
- 优先权： KR10-2014-0105710 20140814; KR10-2015-0097866 20150709
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; H05K1/02 ; H05K1/11 ; H01L23/00 ; H01L23/367 ; H01L23/498 ; H01L25/065
摘要：
An electronic device and semiconductor package include a printed circuit board and a semiconductor device mounted thereon. The printed circuit board includes one or more thermally conductive vias for dissipating heat.
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