- 专利标题: Structure, wiring board and electronic device
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申请号: US14773090申请日: 2014-02-24
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公开(公告)号: US09674942B2公开(公告)日: 2017-06-06
- 发明人: Yoshiaki Kasahara , Hiroshi Toyao
- 申请人: NEC CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: NEC CORPORATION
- 当前专利权人: NEC CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2013-047034 20130308
- 国际申请: PCT/JP2014/054279 WO 20140224
- 国际公布: WO2014/136595 WO 20140912
- 主分类号: H04B3/28
- IPC分类号: H04B3/28 ; H05K1/02 ; H05K1/11
摘要:
A structure comprising: a first and a second conductor planes which are arranged in different layers and in a manner to face to each other; a first transmission line (103) which is arranged in a different layer from those of the first conductor plane and of the second conductor plane, faces to the second conductor plane, and has its one end being an open end; a first conductor via (104) which connects the other end of the first transmission line (103) with the first conductor plane; a second transmission line (105) which is formed in the same layer as that of the first transmission line, runs parallel to the first transmission line (103), and has its one end being an open end; and a second conductor via (106) which electrically connects the other end of the second transmission line (105) with either of the first and second conductor planes.
公开/授权文献
- US20160014887A1 STRUCTURE, WIRING BOARD AND ELECTRONIC DEVICE 公开/授权日:2016-01-14
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