Invention Grant
- Patent Title: Methods and structures for achieving target resistance post CMP using in-situ resistance measurements
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Application No.: US14737915Application Date: 2015-06-12
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Publication No.: US09676075B2Publication Date: 2017-06-13
- Inventor: Laertis Economikos , Elliott P. Rill
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Wanrick LLC
- Agent Yuanmi Cai
- Main IPC: B24B37/00
- IPC: B24B37/00 ; B24B37/005 ; B24B37/20
Abstract:
Various particular embodiments include a method for controlling chemical mechanical polishing, including: polishing a semiconductor wafer in a chemical mechanical polishing (CMP) tool; measuring a resistance of a resistive pathway through the semiconductor wafer while the semiconductor wafer is undergoing polishing in the CMP tool; and terminating the polishing of the semiconductor wafer when the measured resistance reaches a target resistance.
Public/Granted literature
- US20160361791A1 METHODS AND STRUCTURES FOR ACHIEVING TARGET RESISTANCE POST CMP USING IN-SITU RESISTANCE MEASUREMENTS Public/Granted day:2016-12-15
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