Invention Grant
- Patent Title: Fluid ejection device with mixing beads
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Application No.: US15155480Application Date: 2016-05-16
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Publication No.: US09676186B2Publication Date: 2017-06-13
- Inventor: Brian M. Taff
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc.—Patent Department
- Main IPC: B01F13/00
- IPC: B01F13/00 ; B41J2/14 ; B01F11/00 ; B01F13/08

Abstract:
In an embodiment, a fluid ejection device includes a die substrate with a chiclet adhered by its front side to the die substrate. The fluid ejection device also includes an ink delivery slot formed through the chiclet from its back side to its front side. The fluid ejection device further includes a mixing bead at the back side of the chiclet, adjacent the ink delivery slot.
Public/Granted literature
- US20160257116A1 FLUID EJECTION DEVICE WITH MIXING BEADS Public/Granted day:2016-09-08
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