Invention Grant
- Patent Title: Methods for forming a cobalt-ruthenium liner layer for interconnect structures
-
Application No.: US14601685Application Date: 2015-01-21
-
Publication No.: US09677172B2Publication Date: 2017-06-13
- Inventor: Tae Hong Ha , Wei Lei , Kie Jin Park
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: C23C16/04
- IPC: C23C16/04 ; C23C16/56 ; C23C28/02 ; C23C16/16 ; C23C16/02 ; C23C16/455

Abstract:
Methods for forming a liner layer are provided herein. In some embodiments, a method of forming a liner layer on a substrate disposed in a process chamber, the substrate having an opening formed in a first surface of the substrate, the opening having a sidewall and a bottom surface, the method includes exposing the substrate to a cobalt precursor gas and to a ruthenium precursor gas to form a cobalt-ruthenium liner layer on the first surface of the substrate and on the sidewall and bottom surface of the opening.
Public/Granted literature
- US20150203961A1 METHODS FOR FORMING A COBALT-RUTHENIUM LINER LAYER FOR INTERCONNECT STRUCTURES Public/Granted day:2015-07-23
Information query
IPC分类: