Invention Grant
- Patent Title: Finger biometric sensor assembly including direct bonding interface and related methods
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Application No.: US14741831Application Date: 2015-06-17
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Publication No.: US09679187B2Publication Date: 2017-06-13
- Inventor: Milind S. Bhagavat , Patrick E. O'Brien , Jun Zhai , Dale R. Setlak , David D. Coons , Kwan-Yu Lai
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Allen, Dyer, Doppelt & Gilchrist, P.A.
- Main IPC: G06K9/00
- IPC: G06K9/00
Abstract:
A finger biometric sensor assembly may include a finger biometric sensor integrated circuit (IC) die having a finger sensing area and a cover layer aligned with the finger sensing area. The finger biometric sensor may also include a direct bonding interface between the finger biometric sensor and the cover layer.
Public/Granted literature
- US20160371529A1 FINGER BIOMETRIC SENSOR ASSEMBLY INCLUDING DIRECT BONDING INTERFACE AND RELATED METHODS Public/Granted day:2016-12-22
Information query
