Invention Grant
- Patent Title: Circuit connection pad design for improved electrical robustness using conductive epoxy
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Application No.: US14860921Application Date: 2015-09-22
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Publication No.: US09679593B2Publication Date: 2017-06-13
- Inventor: Gary Berscheit , Jackson Brandts
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: Kagan Binder, PLLC
- Main IPC: G11B5/48
- IPC: G11B5/48

Abstract:
Disk drives including head suspensions within dual stage actuation systems have improved electrical connectivity between electrical connection pads from flexible circuits as are applied to head suspension assemblies with piezoelectric microactuators as also provided to head suspension assemblies. A more robust electrical connection provides for better control of microactuator actuation for fine movements and positioning of magnetic read/write heads relative to disk data tracks as part of dual stage actuated suspension systems. Electrical connections utilize conductive epoxy for physically and electrically connecting electrically conductive trace connection pads with one or more surfaces of piezoelectric microactuators. Electrical connections include better conductivity by utilizing plural surface portions of electrical connection pads. The result is a more robust and predictable performance for high data resolution within disk drives.
Public/Granted literature
- US20160086625A1 CIRCUIT CONNECTION PAD DESIGN FOR IMPROVED ELECTRICAL ROBUSTNESS USING CONDUCTIVE EPOXY Public/Granted day:2016-03-24
Information query
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