Invention Grant
- Patent Title: Dual molded stack TSV package
-
Application No.: US14730171Application Date: 2015-06-03
-
Publication No.: US09679801B2Publication Date: 2017-06-13
- Inventor: Kwan-Yu Lai , Jun Zhai , Kunzhong Hu , Flynn P. Carson
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/768 ; H01L25/00 ; H01L23/31 ; H01L23/538 ; H01L25/10 ; H01L21/56 ; H01L23/498 ; H01L23/00
Abstract:
Packages including an embedded die with through silicon vias (TSVs) are described. In an embodiment, a first level die including TSVs is embedded between a first redistribution layer (RDL) and a second RDL, and a second level die is mounted on a top side of the first redistribution layer. In an embodiment, the first level die is an active die, less than 50 μm thick.
Public/Granted literature
- US20160358889A1 DUAL MOLDED STACK TSV PACKAGE Public/Granted day:2016-12-08
Information query
IPC分类:
