Invention Grant
- Patent Title: Curved image sensor systems
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Application No.: US15161726Application Date: 2016-05-23
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Publication No.: US09679931B2Publication Date: 2017-06-13
- Inventor: Wei-Feng Lin , Chi-Chih Huang
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop & Gage LLP
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A curved image sensor system includes (a) an image sensor substrate having a concave light-receiving surface, a pixel array located along the concave light-receiving surface, and a planar external surface facing away from the concave light-receiving surface, (b) a light-transmitting substrate bonded to the image sensor substrate by a bonding layer, and (c) a hermetically sealed cavity, bounded at least by the concave light-receiving surface, the light-transmitting substrate, and the bonding layer.
Public/Granted literature
- US20160268327A1 Curved Image Sensor Systems Public/Granted day:2016-09-15
Information query
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