Invention Grant
- Patent Title: Multilayer ceramic capacitor having multilayer external electrodes and board having the same
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Application No.: US14754282Application Date: 2015-06-29
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Publication No.: US09685272B2Publication Date: 2017-06-20
- Inventor: Young Ghyu Ahn , Hyun Tae Kim , Kyo Kwang Lee , Jin Kim , Byoung Hwa Lee , Hwi Geun Im
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0023639 20140227; KR10-2014-0143390 20141022
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/228 ; H01G2/06 ; H01G4/012 ; H01G4/12 ; H05K1/18 ; H05K1/11 ; H01G4/232

Abstract:
A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes three external electrodes including a conductive layer, a nickel plating layer, and a tin plating layer sequentially stacked on a mounting surface of the ceramic body, and spaced apart from each other. When an outermost portion of a lead-out portion of an internal electrode exposed to the mounting surface is P, a total thickness of the conductive layer, the nickel plating layer, and the tin plating layer in a normal line direction of the conductive layer from P is a, a thickness of the conductive layer in the normal line direction of the conductive layer from P is b, and a sum of pore heights of pores existing in the conductive layer in the normal line direction of the conductive layer from P is bp, (b−bp)/a satisfies 0.264≦(b−bp)/a≦0.638.
Public/Granted literature
- US20150318114A1 MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME Public/Granted day:2015-11-05
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