Invention Grant
- Patent Title: Method for manufacturing a semiconductor device
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Application No.: US15096632Application Date: 2016-04-12
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Publication No.: US09685561B2Publication Date: 2017-06-20
- Inventor: Mitsuhiro Ichijo , Toshiya Endo , Kunihiko Suzuki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratories Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratories Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2010-139207 20100618
- Main IPC: H01L29/12
- IPC: H01L29/12 ; H01L29/786 ; H01L29/49 ; H01L29/66 ; H01L21/02 ; H01L21/441 ; H01L21/477 ; H01L29/47 ; H01L29/24 ; H01L29/423

Abstract:
An object is to provide a semiconductor device having good electrical characteristics. A gate insulating layer having a hydrogen concentration less than 6×1020 atoms/cm3 and a fluorine concentration greater than or equal to 1×1020 atoms/cm3 is used as a gate insulating layer in contact with an oxide semiconductor layer forming a channel region, so that the amount of hydrogen released from the gate insulating layer can be reduced and diffusion of hydrogen into the oxide semiconductor layer can be prevented. Further, hydrogen present in the oxide semiconductor layer can be eliminated with the use of fluorine; thus, the hydrogen content in the oxide semiconductor layer can be reduced. Consequently, the semiconductor device having good electrical characteristics can be provided.
Public/Granted literature
- US20160225909A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-08-04
Information query
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