An apparatus for forming holes in a glass substrate, includes a laser source that irradiates a laser beam on a first surface of the glass substrate, and a base plate on which a second surface of the glass substrate, opposite to the first surface, is placed. The base plate includes a recessed area in a central part thereof, and supports arranged within the recessed area to support the glass substrate. At least a part of the supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the supports extend. One support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval that is shorter than 30 mm, and the supports have a height that is higher than 70 μm.