Invention Grant
- Patent Title: Insulating paste, electronic device and method for forming insulator
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Application No.: US14085377Application Date: 2013-11-20
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Publication No.: US09691519B2Publication Date: 2017-06-27
- Inventor: Shigenobu Sekine , Yurina Sekine
- Applicant: NAPRA CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NAPRA CO., LTD.
- Current Assignee: NAPRA CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-257828 20121126
- Main IPC: B05D3/02
- IPC: B05D3/02 ; H01B3/18 ; H01B3/46 ; H01B13/06 ; H01B3/00 ; H01L23/48 ; H01L21/02 ; H01L21/768
Abstract:
An insulating paste includes insulating particles 311, Si particles 312 and an organic Si compound 320. The organic Si compound 320 reacts with the Si particles 312 to form a Si—O bond filling up the space around the insulating particles 311.
Public/Granted literature
- US20140147578A1 INSULATING PASTE, ELECTRONIC DEVICE AND METHOD FOR FORMING INSULATOR Public/Granted day:2014-05-29
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