- 专利标题： Wiring board and manufacturing method thereof
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申请号： US13397867申请日： 2012-02-16
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公开(公告)号： US09693466B2公开(公告)日： 2017-06-27
- 发明人: Akira Harao , Mototatsu Matsunaga , Yusuke Takagi , Akinori Saneto
- 申请人： Akira Harao , Mototatsu Matsunaga , Yusuke Takagi , Akinori Saneto
- 申请人地址： JP Tokyo
- 专利权人： Yazaki Corporation
- 当前专利权人： Yazaki Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Locke Lord LLP
- 优先权： JP2011-035338 20110222; JP2011-136176 20110620
- 主分类号： H05K3/44
- IPC分类号： H05K3/44 ; H05K3/32 ; H05K1/03 ; H05K1/05
摘要：
The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.
公开/授权文献
- US20120211266A1 WIRING BOARD AND MANUFACTURING METHOD THEREOF 公开/授权日：2012-08-23
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