Invention Grant
- Patent Title: Puncture repair device
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Application No.: US14654495Application Date: 2013-11-28
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Publication No.: US09694548B2Publication Date: 2017-07-04
- Inventor: Hideyuki Takahara
- Applicant: The Yokohama Rubber Co., LTD.
- Applicant Address: JP
- Assignee: The Yokohama Rubber Co., LTD.
- Current Assignee: The Yokohama Rubber Co., LTD.
- Current Assignee Address: JP
- Agency: Thorpe North & Western
- Priority: JP2012-278471 20121220
- International Application: PCT/JP2013/082056 WO 20131128
- International Announcement: WO2014/097847 WO 20140626
- Main IPC: B65B31/00
- IPC: B65B31/00 ; B29C73/02 ; B29C73/24 ; B29C73/16
Abstract:
A puncture repair device comprises a compressor and a vessel supplied with compressed air by the compressor and containing puncture repair liquid to be pumped to a cavity of a tire. The puncture repair liquid is heated by the heat generated by the compressor.
Public/Granted literature
- US20150343724A1 Puncture Repair Device Public/Granted day:2015-12-03
Information query
