Invention Grant
- Patent Title: Hinge having multiple degrees of freedom
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Application No.: US14225933Application Date: 2014-03-26
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Publication No.: US09696754B2Publication Date: 2017-07-04
- Inventor: Russell S. Aoki , Jeff Ku , Sheng-Chao Lin
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: G06F1/16
- IPC: G06F1/16
Abstract:
Techniques for forming a hinge are described herein. The hinge is to couple a first housing of a computing device and a second housing of the computing device. The hinge is to cause the first housing to have three degrees of freedom in movement from the second housing.
Public/Granted literature
- US20150277488A1 HINGE HAVING MULTIPLE DEGREES OF FREEDOM Public/Granted day:2015-10-01
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