Invention Grant
- Patent Title: Assembled circuit and electronic component
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Application No.: US14696382Application Date: 2015-04-25
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Publication No.: US09697950B2Publication Date: 2017-07-04
- Inventor: Jian-Hong Zeng , Wei Yang , Shou-Yu Hong , Jian-Ping Ying
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD.
- Current Assignee: CYNTEC CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Priority: TW97100160A 20080103
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H05K1/14 ; H05K7/02 ; H01F27/28 ; H01F17/00 ; H01F17/04 ; H02M3/00 ; H05K3/34

Abstract:
An electrical component is disclosed, the electrical component comprising: a magnetic body having a top surface, a bottom surface, wherein at least one first conductive through hole is formed from the top surface to bottom surface of the magnetic body; and a coil disposed in the magnetic body, wherein a first end of the coil is electrically connected to one of the at least one first conductive through hole.
Public/Granted literature
- US20150228400A1 ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT Public/Granted day:2015-08-13
Information query