Invention Grant
- Patent Title: Capacitor structure of integrated circuit chip and method of fabricating the same
-
Application No.: US15088045Application Date: 2016-03-31
-
Publication No.: US09698214B1Publication Date: 2017-07-04
- Inventor: Nan-Chi Lu , Chen-Chieh Chiang , Chi-Cherng Jeng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Jiang Chyun IP Office
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L49/02 ; H01L23/522

Abstract:
In accordance with some embodiments of the present disclosure, a capacitor structure of an integrated circuit chip includes an insulation layer, a first electrode, and a second electrode. The insulation layer includes an insulation partition and has a first trench and a second trench separated from the first trench by the insulation partition. The first electrode is disposed in the first trench. The second electrode is disposed in the second trench. The first electrode first electrode is arranged along a spiral trajectory and surrounds a spiral channel. The second electrode is disposed within the spiral channel.
Information query
IPC分类: