A multi-chip module (MCM) includes: an interposer, a photonic chip, an optical gain chip, and a waveguide-fiber connector. The photonic chip, which may be electrically coupled to the interposer, may be implemented using a silicon-on-insulator (SOI) technology, and may include an optical waveguide that conveys an optical signal. Moreover, the optical gain chip, which may be electrically coupled to the interposer, may include a III-V compound semiconductor, and may include a second optical waveguide that conveys the optical signal and that is vertically aligned with the optical waveguide relative to a top surface of the interposer. Furthermore, the waveguide-fiber connector may be mechanically coupled to the interposer, and remateably mechanically coupled to an optical fiber coupler that includes the optical fiber. The waveguide-fiber connector may convey the optical signal between the optical waveguide in the photonic chip and the optical fiber.