Invention Grant
- Patent Title: Semiconductor package modules, memory cards including the same, and electronic systems including the same
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Application No.: US14813359Application Date: 2015-07-30
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Publication No.: US09699907B2Publication Date: 2017-07-04
- Inventor: Jung Tae Jeong
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: William Park & Associates Ltd.
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K9/00 ; H05K1/18 ; H05K3/34 ; H01L23/498
Abstract:
A semiconductor package module may include a first substrate, and a second substrate disposed to face the first substrate. The semiconductor package module may include an interconnection member electrically connecting the first substrate to the second substrate and including a plurality of wires. Portions of the plurality of wires may be twisted and wound together and may be bent to extend in a predetermined direction.
Public/Granted literature
Information query
