Invention Grant
- Patent Title: Wiring film and active matrix substrate using the same, and method for manufacturing wiring film
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Application No.: US13604452Application Date: 2012-09-05
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Publication No.: US09704742B2Publication Date: 2017-07-11
- Inventor: Kazuyuki Fujiwara , Kazunori Inoue , Takahito Yamabe
- Applicant: Kazuyuki Fujiwara , Kazunori Inoue , Takahito Yamabe
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2011-193849 20110906
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/283 ; H01L21/768 ; H01L29/45 ; H01L29/49 ; H01L27/12

Abstract:
An Al wiring film having a tapered shape is obtained easily and in a stable manner. An Al wiring film has a double-layer structure including a first Al alloy layer made of Al or an Al alloy, and a second Al alloy layer laid on the first Al alloy layer and having a composition different from a composition of the first Al alloy layer by containing at least one element of Ni, Pd, and Pt. The second Al alloy layer is etched by an alkaline chemical solution used in a developing process of a photoresist, and an end portion of the second Al alloy layer recedes from an end portion of the photoresist. Thereafter, by performing wet etching using the photoresist as a mask, a cross section of the Al wiring film becomes a tapered shape.
Public/Granted literature
- US20130056737A1 WIRING FILM AND ACTIVE MATRIX SUBSTRATE USING THE SAME, AND METHOD FOR MANUFACTURING WIRING FILM Public/Granted day:2013-03-07
Information query
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