Invention Grant
- Patent Title: Chip package and method for forming the same
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Application No.: US15008241Application Date: 2016-01-27
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Publication No.: US09704772B2Publication Date: 2017-07-11
- Inventor: Chien-Hung Liu
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Priority: TW103112268A 20140402; TW103128390A 20140819
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/31 ; H01L21/56 ; H05K1/18 ; H05K1/02 ; H05K1/11 ; H05K3/32 ; G06K9/00 ; G01L19/14 ; G06F21/32 ; H01L21/02 ; G01L19/00 ; G01L19/06 ; H01L23/525 ; H01L21/60

Abstract:
A chip package includes a chip, a dam layer, a permanent adhesive layer, a support, a buffer layer, a redistribution layer, a passivation layer, and a conducting structure. A conducting pad and a sensing device of the chip are located on a first surface of a substrate of the chip, and the conducting pad protrudes from the side surface of the substrate. The dam layer surrounds the sensing device. The permanent adhesive layer is between the support and the substrate. The support and the permanent adhesive layer have a trench to expose the conducting pad. The buffer layer is located on the support. The redistribution layer is located on the buffer layer and on the support, the permanent adhesive layer, and the conducting pad facing the trench. The passivation layer covers the redistribution layer, the buffer layer, and the conducting pad.
Public/Granted literature
- US20160141219A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2016-05-19
Information query
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