The invention provides a semiconductor package. The semiconductor package includes a lead frame including a die paddle. A supporting bar connects to the die paddle, extending in an outward direction from the die paddle. At least two power leads are separated from the die paddle and the supporting bar, having first terminals close to the die paddle and second terminals extending outward from the die paddle. A power bar connects to the at least two power leads, having a supporting portion. A molding material encapsulates the lead frame leaving the supporting portion exposed.