Invention Grant
- Patent Title: Method and device for embedded SIM provisioning
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Application No.: US14803946Application Date: 2015-07-20
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Publication No.: US09705546B2Publication Date: 2017-07-11
- Inventor: Sang Soo Lee , Duc Key Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2014-0091393 20140719
- Main IPC: H04M1/66
- IPC: H04M1/66 ; H04M1/68 ; H04M3/16 ; H04B1/38 ; H04B1/3816 ; H04W8/20 ; H04W8/18 ; H04W12/06

Abstract:
A method and an electronic device are provided for embedded SIM (eSIM) provisioning. The electronic device includes a first interface configured to transmit a request message for requesting a profile from a profile generation server, and to receive a plurality of packets associated with installation of the profile, in response to the request message; a processor configured to generate an image file from the plurality of packets; an authentication module configured to perform authentication with the profile generation server and authenticate an electronic device including an embedded SIM (eSIM); and a second interface configured to connect the server device to the electronic device, and to transmit the image file to the electronic device, if the electronic device is authenticated.
Public/Granted literature
- US20160020802A1 METHOD AND DEVICE FOR EMBEDDED SIM PROVISIONING Public/Granted day:2016-01-21
Information query