Invention Grant
- Patent Title: L-bending PCB
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Application No.: US14428358Application Date: 2015-01-07
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Publication No.: US09706645B2Publication Date: 2017-07-11
- Inventor: Hu He
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201410707847 20141127
- International Application: PCT/CN2015/070305 WO 20150107
- International Announcement: WO2016/082315 WO 20160602
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00 ; H05K1/05

Abstract:
A L-Bending PCB includes a straight portion and a bending portion connecting to the straight portion, the straight portion has a metal substrate bottom, an insulation layer, a conductive layer and a protective layer. The insulation layer is disposed on a partial surface of the metal substrate bottom, the conductive layer is disposed on the insulation layer and the protective layer is disposed on the conductive layer.
Public/Granted literature
- US20160353564A1 L-Bending PCB Public/Granted day:2016-12-01
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