- 专利标题: Chip on film flexible circuit board and display device
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申请号: US14235955申请日: 2013-12-12
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公开(公告)号: US09713249B2公开(公告)日: 2017-07-18
- 发明人: Liang Cheng , Yang Li , Peng Qi , Yang Huang , Xiaowei Gong , Lian Sun , Chunyang Nie , Min Wang
- 申请人: HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- 申请人地址: CN Hefei
- 专利权人: HEFEI Optoelectronics Technology Co., Ltd.
- 当前专利权人: HEFEI Optoelectronics Technology Co., Ltd.
- 当前专利权人地址: CN Hefei
- 代理机构: Banner & Witcoff, Ltd.
- 优先权: CN201310153971 20130427
- 国际申请: PCT/CN2013/089305 WO 20131212
- 国际公布: WO2014/173144 WO 20141030
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; H05K1/02 ; H05K1/11 ; H05K3/32
摘要:
A Chip on Film (COF) flexible circuit board and a display device using the COF flexible circuit board are provided. The circuit board includes: a substrate; a plurality of conductive terminals arranged separately in parallel over the substrate, each of the plurality of conductive terminals including a wide line and a narrow line; and a anisotropic conductive adhesive region provided over the substrate. A connection site of the wide line and the narrow line is located in an overlapping area of the anisotropic conductive adhesive region and the substrate. The embodiments of the invention can reduce the probability of the circuit board being broken and the undesirable phenomena such as open circuit.
公开/授权文献
- US20150173170A1 CHIP ON FILM FLEXIBLE CIRCUIT BOARD AND DISPLAY DEVICE 公开/授权日:2015-06-18
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