Invention Grant
- Patent Title: Light interconnection device using plasmonic via
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Application No.: US14859756Application Date: 2015-09-21
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Publication No.: US09715063B2Publication Date: 2017-07-25
- Inventor: Yeonsang Park , Younggeun Roh , Jineun Kim , Changwon Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0173235 20141204
- Main IPC: G02B6/122
- IPC: G02B6/122 ; G02B6/125 ; G02B6/43
Abstract:
A light interconnection device includes a metal-insulator-metal (MIM) waveguide including first and second metal layers and a dielectric layer provided between the first and second metal layers, and a plasmonic antenna including a slot penetrating through the second metal layer.
Public/Granted literature
- US20160161671A1 LIGHT INTERCONNECTION DEVICE USING PLASMONIC VIA Public/Granted day:2016-06-09
Information query
