发明授权
- 专利标题: Semiconductor device comprising a conductive film joining a diode and switching element
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申请号: US14894456申请日: 2013-08-28
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公开(公告)号: US09716052B2公开(公告)日: 2017-07-25
- 发明人: Tsuyoshi Osaga , Mikio Ishihara , Kazuaki Hiyama , Tatsuya Kawase
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Studebaker & Brackett PC
- 国际申请: PCT/JP2013/072960 WO 20130828
- 国际公布: WO2015/029159 WO 20150305
- 主分类号: H01L23/34
- IPC分类号: H01L23/34 ; H01L29/861 ; H01L27/06 ; H01L29/423 ; H01L29/739 ; H01L29/78 ; H01L23/538 ; H01L23/495 ; H01L23/00
摘要:
A ground working tool comprising a tubular base body with an inner receiving space for receiving a cylindrical core of solid ground material, connector mechanism for connecting the tubular base body with a rotary drive and locking mechanism for locking the core in the receiving space of the tubular base body. The locking mechanism involves at least one locking unit having a guide rail being disposed at an inner side of the tubular base body and arranged with a deviation angle relative to a tangential direction of the tubular base body and the locking unit further comprises at least one locking element, which is moveably mounted on the guide rail between a radially outer releasing position and a radially inner locking position, in which the core is clamped within the receiving space by means of the at least one locking element.
公开/授权文献
- US20160126156A1 SEMICONDUCTOR DEVICE 公开/授权日:2016-05-05