A fluid application device having a modular nozzle assembly is provided. The fluid application device includes an applicator head and a modular nozzle assembly fluidly coupled thereto. The modular nozzle assembly includes at least one guide slot configured to receive a strand of material, at least one orifice configured to discharge a first fluid onto a respective strand of material, and at least one securing opening extending through the modular nozzle assembly. Each securing opening is configured to receive a releasable securing element. The modular nozzle assembly may be a contact nozzle assembly or a non-contact nozzle assembly, and include fluid or air assist for altering a flow of the first fluid. The modular nozzle assembly may be selectively removed from and secured to the fluid application device so that the modular nozzle assembly may be selectively switched between the contact nozzle assembly and the non-contact nozzle assembly.