Invention Grant
- Patent Title: Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board
-
Application No.: US14115306Application Date: 2012-04-27
-
Publication No.: US09718941B2Publication Date: 2017-08-01
- Inventor: Takashi Matsuda , Mitsuyoshi Nishino , Kiyotaka Komori
- Applicant: Takashi Matsuda , Mitsuyoshi Nishino , Kiyotaka Komori
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-103192 20110502
- International Application: PCT/JP2012/002906 WO 20120427
- International Announcement: WO2012/150661 WO 20121108
- Main IPC: C08K3/00
- IPC: C08K3/00 ; H05K1/03 ; B32B15/092 ; C08L63/00 ; C08J5/24 ; C08K3/22 ; C08K3/26

Abstract:
Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D50) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.
Public/Granted literature
- US20140087614A1 THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND CIRCUIT BOARD Public/Granted day:2014-03-27
Information query