Invention Grant
- Patent Title: Solid-state imaging device, method of manufacturing the same, and electronic equipment
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Application No.: US15426491Application Date: 2017-02-07
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Publication No.: US09721985B2Publication Date: 2017-08-01
- Inventor: Susumu Hiyama , Kazufumi Watanabe
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2010-082488 20100331
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least one of first and the second antireflection film.
Public/Granted literature
- US20170148837A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT Public/Granted day:2017-05-25
Information query
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