- 专利标题: Semiconductor device and semiconductor module
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申请号: US14926475申请日: 2015-10-29
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公开(公告)号: US09722060B2公开(公告)日: 2017-08-01
- 发明人: Hiroyuki Nakamura , Akira Okada , Eiji Nojiri
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Studebaker & Brackett PC
- 优先权: JP2015-028540 20150217
- 主分类号: H01L29/73
- IPC分类号: H01L29/73 ; H01L29/739 ; H01L29/423 ; H01L23/544 ; H01L21/66
摘要:
In a semiconductor device, an element forming region formed with a semiconductor element for controlling a current is defined on a surface of a semiconductor substrate. A termination region is defined so as to surround the element forming region. In a gate electrode, a probe-contacting region and a wire region are defined. The probe-contacting region and the wire region are separated by an insulator formed on a surface of the gate electrode. Thus, the surface of the probe-contacting region and the surface of the wire region are located at the same height.
公开/授权文献
- US20160240637A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE 公开/授权日:2016-08-18
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