Invention Grant
- Patent Title: Source/drain junction formation
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Application No.: US14056711Application Date: 2013-10-17
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Publication No.: US09722083B2Publication Date: 2017-08-01
- Inventor: Chun Hsiung Tsai , Sheng-Wen Yu , Ziwei Fang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/425
- IPC: H01L21/425 ; H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L29/08 ; H01L21/265 ; H01L29/165

Abstract:
An embodiment method of forming a source/drain region for a transistor includes forming a recess in a substrate, epitaxially growing a semiconductor material in the recess, amorphizing the semiconductor material, and doping the semiconductor material to form a source/drain region. In an embodiment, the doping utilizes either phosphorus or boron as the dopant. Also, the amorphizing and the doping may be performed simultaneously. The amorphizing may be performed at least in part by doping with helium.
Public/Granted literature
- US20150111359A1 Source/Drain Junction Formation Public/Granted day:2015-04-23
Information query
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