In general, according to one embodiment, a film coating apparatus includes a discharge section configured to discharge a film formation material; a voltage application section configured to apply a voltage to the film formation material, and to set the film formation material at a high potential relative to a film formation object which is subjected to film formation; a mask disposed at a position overlapping a non-coating portion of the film formation object along a direction from the discharge section toward the non-coating portion; and a potential adjusting module configured to make a potential of the mask equal to a potential of the film formation object.