A fluid application device having an applicator head, a slot die assembly and a securing mechanism for securing the slot die assembly to the applicator head is provided. The slot die assembly includes a die extruder comprising one or more fluid input ports configured to receive a fluid from the applicator head, a shim positioned adjacent to the die extruder, and a plate positioned adjacent to the shim on a side of the shim opposite from the die extruder. The securing mechanism includes a securing component at one of the applicator head and the slot die assembly and a corresponding securing component at the other of the applicator head and slot die assembly.