Invention Grant
- Patent Title: Apparatus and process for cutting adhesive labels
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Application No.: US14867294Application Date: 2015-09-28
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Publication No.: US09724837B2Publication Date: 2017-08-08
- Inventor: Alan Green , Dennis R. Benoit
- Applicant: Avery Dennison Corporation
- Applicant Address: US CA Glendale
- Assignee: Avery Dennison Corporation
- Current Assignee: Avery Dennison Corporation
- Current Assignee Address: US CA Glendale
- Agency: Avery Dennison Corporation
- Main IPC: B26D7/08
- IPC: B26D7/08 ; B26F1/38 ; B32B38/04 ; B32B38/10 ; B26D7/10 ; B31D1/02 ; B26D7/00 ; B26D1/36 ; B32B37/08 ; B32B38/00
Abstract:
A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.
Public/Granted literature
- US20160016323A1 Apparatus and Process for Cutting Adhesive Labels Public/Granted day:2016-01-21
Information query
