Invention Grant
- Patent Title: Cutting apparatus
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Application No.: US14336148Application Date: 2014-07-21
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Publication No.: US09724838B2Publication Date: 2017-08-08
- Inventor: Nobuhiko Wakita
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2013-151913 20130722
- Main IPC: B26D7/26
- IPC: B26D7/26 ; B26D7/22 ; B28D5/02 ; H01L21/304 ; B27B5/32 ; B26D1/14 ; B26D1/16 ; B26D5/00

Abstract:
A cutting unit includes a spindle housing, a spindle, a mounter fixed to the front end portion of the spindle for supporting a cutting blade, and a fixing flange for fixing the cutting blade to the mounter. The mounter includes a boss portion for axially slidably supporting the fixing flange, the boss portion being fitted to an engaging hole formed in a central portion of the fixing flange, a flange portion projecting radially outward from the outer circumference of the boss portion, the flange portion having a supporting surface for supporting the cutting blade on the front side opposed to the fixing flange, and a cylindrical portion formed on the rear side of the flange portion. The flange portion has a suction hole opening. The cylindrical portion has a communication passage communicating with the suction hole. The communication passage is connected through a rotary joint to a suction unit.
Public/Granted literature
- US20150020670A1 CUTTING APPARATUS Public/Granted day:2015-01-22
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