Invention Grant
- Patent Title: Preforms made directly from thermosetting composite chips
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Application No.: US14711087Application Date: 2015-05-13
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Publication No.: US09724854B2Publication Date: 2017-08-08
- Inventor: Bruno Boursier
- Applicant: Hexcel Corporation
- Applicant Address: GB Cambridge
- Assignee: Hexcel Composites Limited
- Current Assignee: Hexcel Composites Limited
- Current Assignee Address: GB Cambridge
- Agent W. Mark Bielawski; David J. Oldenkamp
- Main IPC: B29C43/02
- IPC: B29C43/02 ; B29B11/16

Abstract:
Preforms for use in molding composite parts are made directly from composite chips that are composed of fibers and an uncured thermosetting resin. Cold composite chips are formed into a stream of non-agglomerating chips that is used to fill the cavity of a preform tool. The non-agglomerating chips flow into the preform tool cavity to form a population of non-cohesive composite chips. The non-cohesive composite chips are then heated to form a preform made up of a consolidated population of cohesive composite chips in which the non-sticky uncured thermosetting resin of the non-cohesive chips has been converted to a sticky uncured thermosetting resin.
Public/Granted literature
- US20160332339A1 PREFORMS MADE DIRECTLY FROM THERMOSETTING COMPOSITE CHIPS Public/Granted day:2016-11-17
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